(1) Temperature
When the temperature is raised, the copper deposition rate of the electroless copper plating solution increases, but the stability of the plating solution also decreases. When the temperature is too high, the plating solution rapidly decomposes and the temperature is generally controlled at 60. C is the most appropriate. Considering the stability of the plating solution, the operating temperature is controlled at room temperature. Although the plating speed is not very fast at this temperature, the plating solution is relatively stable and satisfactory copper plating can be obtained.
(2) pH
The relationship between the pH value and the plating rate, for example, in a bath using formaldehyde as a reducing agent, when the pH is lower than 12, the deposition of copper does not substantially proceed. When the pH is greater than l2, the reaction may proceed. As the pH value increases, the copper sinking rate of sink copper increases rapidly. However, when the pH value is higher than 13.5, the bath solution begins to decompose automatically.
When the temperature is raised, the copper deposition rate of the electroless copper plating solution increases, but the stability of the plating solution also decreases. When the temperature is too high, the plating solution rapidly decomposes and the temperature is generally controlled at 60. C is the most appropriate. Considering the stability of the plating solution, the operating temperature is controlled at room temperature. Although the plating speed is not very fast at this temperature, the plating solution is relatively stable and satisfactory copper plating can be obtained.
(2) pH
The relationship between the pH value and the plating rate, for example, in a bath using formaldehyde as a reducing agent, when the pH is lower than 12, the deposition of copper does not substantially proceed. When the pH is greater than l2, the reaction may proceed. As the pH value increases, the copper sinking rate of sink copper increases rapidly. However, when the pH value is higher than 13.5, the bath solution begins to decompose automatically.