(1) When the temperature is increased, the copper deposition rate of the electroless copper plating solution increases, but the stability of the plating solution also decreases. When the temperature is too high, the plating solution rapidly decomposes, and the temperature is generally controlled at 60°C. C is the most appropriate. Considering the stability of the plating solution, the operating temperature is controlled at room temperature. Although the plating speed is not very fast at this temperature, the plating solution is relatively stable and satisfactory copper plating can be obtained.
(2) pH The relationship between pH and plating rate, such as plating solution with formaldehyde as reducing agent, when the pH value is lower than 12, the reaction of depositing copper is basically not carried out. When the pH value is greater than l2, the reaction It is possible that, as the pH value increases, the copper sinking rate of sink copper increases rapidly, but when the pH value is higher than 13.5, the bath solution starts to decompose automatically.
(2) pH The relationship between pH and plating rate, such as plating solution with formaldehyde as reducing agent, when the pH value is lower than 12, the reaction of depositing copper is basically not carried out. When the pH value is greater than l2, the reaction It is possible that, as the pH value increases, the copper sinking rate of sink copper increases rapidly, but when the pH value is higher than 13.5, the bath solution starts to decompose automatically.