It is very important that the electroless copper plating solution is stable. In order to improve the stability of the bath, in addition to adding the stabilizer, the following points must also be noted.
1 Care should be taken to keep the bath clean. Continuous filtration or periodic filtration should be used to remove copper particles and other impurities from the bath. In the non-metal plating, the sensitized liquid and the activating liquid should be prevented from being brought in, and the plating on the groove wall should be removed in time.
When the bath is not used, use dilute sulfuric acid to adjust the pH to 9-10. When using, dilute sodium hydroxide solution to adjust the pH to the normal range.
3 When feeding, the material must be diluted with a solution and added with stirring.
4 If the bath is heated, a water jacket jacket should be used to prevent local overheating of the bath.
(2) Appropriate control of the loading The loading of the electroless copper plating should be appropriate. If the loading is too high, it will cause decomposition of the plating solution. If the loading is too low, the production efficiency will be reduced. Its loading is generally controlled at 2~3dm2/L.
(3) Bath Stirring It is best to stir the electroless copper plating solution with air. This will not only inhibit the formation of Cu20, but also eliminate bubbles on the surface of the plating.
(4) Periodically analyze and adjust the plating solution. The plating solution should be analyzed regularly. If conditions are available, it is better to use the operation method that automatically controls the composition and operating conditions of the plating solution. If the conditions are not enough, you can periodically replace some of the old bath with the old bath to maintain and adjust the bath.
1 Care should be taken to keep the bath clean. Continuous filtration or periodic filtration should be used to remove copper particles and other impurities from the bath. In the non-metal plating, the sensitized liquid and the activating liquid should be prevented from being brought in, and the plating on the groove wall should be removed in time.
When the bath is not used, use dilute sulfuric acid to adjust the pH to 9-10. When using, dilute sodium hydroxide solution to adjust the pH to the normal range.
3 When feeding, the material must be diluted with a solution and added with stirring.
4 If the bath is heated, a water jacket jacket should be used to prevent local overheating of the bath.
(2) Appropriate control of the loading The loading of the electroless copper plating should be appropriate. If the loading is too high, it will cause decomposition of the plating solution. If the loading is too low, the production efficiency will be reduced. Its loading is generally controlled at 2~3dm2/L.
(3) Bath Stirring It is best to stir the electroless copper plating solution with air. This will not only inhibit the formation of Cu20, but also eliminate bubbles on the surface of the plating.
(4) Periodically analyze and adjust the plating solution. The plating solution should be analyzed regularly. If conditions are available, it is better to use the operation method that automatically controls the composition and operating conditions of the plating solution. If the conditions are not enough, you can periodically replace some of the old bath with the old bath to maintain and adjust the bath.