
At present, domestic private mold enterprises generally have advanced equipment resources and relatively advanced technology applications. New technologies can be applied widely and quickly in the industry, from design and manufacturing to related materials production, heat treatment, etc., to form an industrial chain, and the advantages of integration are outstanding. Currently, due to lack of funds and lack of own brands, hardware mold enterprises will increase investment in management and technological transformation, expand the proportion of high-end products, and establish domestic sales departments to actively expand the domestic market.
In the increasingly fierce competition in the international die casting mold market, the Japanese die casting mold industry is also working to reduce production costs. In terms of market size, Japan's recession is most obvious regardless of output value or domestic demand. Japanese mold manufacturers pay more attention to the polishing and lapping processing technology. German mold manufacturers start by improving the precision and efficiency of machining and electrical discharge machining to reduce manual processing time. At present, the die-casting mold industry in Japan is gradually shifting the molds with low technological content to areas with low labor costs, and only producing products with higher technological content in Japan. This accelerates the shift towards foreign countries, which makes the use of die-casting molds in Japan. Reduced quantity.
Experts believe that due to the gradual decline in domestic demand from Japan, the United States, Germany, and other global die-producing countries, and the increase in costs, moldmakers in these countries have begun to shift production and gradually expand the Chinese market. We hope to increase profits through China's cheap labor and material procurement costs. However, once the mold manufacturing enterprises in these countries enter the east, they will inevitably make their country's mold design and manufacturing technology invisible. In this way, it is necessary to invest a large amount of R&D expenses again to strengthen the competitiveness of its mold products, thereby opening up the differences between it and Chinese mold products.
In recent years, due to the impact of the international financial crisis, there has been a global market shrinkage, but according to relevant data, as of the first half of the year, Japan is still the world's leading producer of die-casting molds, its profits have not shrunk, and its competitiveness has remained strong. Hardware molds already have strong competitiveness. Experts believe that the greatest strengths and strengths lie in both private and traditional industries. To enter the high-end market, can not do without high-tech. On the other hand, although the entry of foreign mold companies will intensify the competition of domestic molds to a certain extent, the entry of these high-end mold companies has also promoted the awareness of domestic mold competition from another perspective, which will increase technology. Improve and improve the overall mold manufacturing level.
Compression fixation compounds use heat and pressure to encapsulate the sample. Compression fixation media include resins, phenolic powders, compression fixation powders and preforms that minimize shrinkage during preparation while protecting and preserving sample edges.
The choice of compression packer compound depends on laboratory objectives and the requirements of final analysis. Many different powders and preformed molds can be used to meet a variety of needs, including colorful universal phenolic powders, hard mineral filling compounds, transparent thermoplastic compounds and conductive compounds for SEM analysis.
The choice of compression packer compound depends on laboratory objectives and the requirements of final analysis. Many different powders and preformed molds can be used to meet a variety of needs, including colorful universal phenolic powders, hard mineral filling compounds, transparent thermoplastic compounds and conductive compounds for SEM analysis.

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