Epoxy resin cured materials have excellent mechanical properties, electrical properties, chemical resistance properties, and thus have been widely used. The curing agent is one of the raw materials necessary for curing the epoxy resin, otherwise the epoxy resin will not cure. In order to meet the requirements of various applications, the appropriate curing agent should be used. There are many types of curing agents, which are described below:
Ethylenediamine EDAH2NCH2CH2NH2 Molecular Weight 60 Active Hydrogen Equivalent 15 Colorless liquid 6-8 parts per 100 parts standard resin Performance: Toxic, odor, volatile, low viscosity, fast curing at room temperature. For bonding, casting, coating. As the molecular weight increases, the viscosity of the amine increases, the volatility decreases, the toxicity decreases, and the performance increases. However, they have a large amount of heat and a short pot life. In general, the larger the molecular weight, the smaller the influence of the compounding amount. Prolonged exposure to fatty polyamines can cause dermatitis, their vapor toxicity is very strong, and care must be taken when handling them.
Diethylenetriamine DETAH2NC2H4NHC2H4NH2 Molecular Weight 103 Active Hydrogen Equivalent 20.6 Colorless liquid 8-11 parts per 100 parts standard resin. Curing: 20°C 2 hours + 100°C 30 minutes or 20°C 4 days. Performance: Applicable period 50g 25 °C 45 minutes, heat distortion temperature 95-124 °C, bending strength 1000-1160kg/cm2, compressive strength 1120kg/cm2, tensile strength 780kg/cm2, elongation 5.5%, impact strength 0.4 ft-inches Rockwell hardness 99-108. Dielectric constant (50Hz, 23°C) 4.1 Power factor (50Hz, 23°C) 0.009 volume resistance 2x1016Ω-cm Curing at room temperature, high toxicity, large heat release, short pot life.
Triethylenetetramine TETAH2NC2H4NHC2H4NHC2H4NH2 Molecular Weight 146 Active Hydrogen Equivalent 24.3 Colorless viscous liquid Curing with 10-13 parts per 100 parts standard resin: 20°C for 2 hours + 100°C for 30 minutes or 20°C for 7 days. Performance: Applicable period 50g 25°C 45min, heat distortion temperature 98-124°C, bending strength 950-1200kg/cm2, compressive strength 1100kg/cm2, tensile strength 780kg/cm2, elongation 4.4%, impact strength 0.4 ft-inches Rockwell hardness 99-106. Room temperature curing, toxicity slightly lower than the diethylene triamine, heat release, short pot life.
Tetraethylenepentamine TEPAH2NC2H4(NHC2H4)3NH2 Molecular weight 189 Active hydrogen Equivalent 27 Brown liquid Per 100 parts Standard resin 11-15 parts Same as above.
Polyethylene polyamine PEPAH2NC2H4 (NHC2H4)nNH2 light yellow liquid with 14-15 parts per 100 parts standard resin Performance: Less toxicity, low volatility, long pot life, inexpensive.
Dipropylenetriamine DPTAH2N(CH2)3NH(CH2)3NH2 Molecular Weight 131 Active Hydrogen Equivalent 26 Light yellow liquid 12-15 parts per 100 parts standard resin Performance Same as TETA.
Dimethylamine Propylamine DMAPA(CH3)2N(CH2)3NH2 Low Viscosity Clear Liquid 4-7 parts per 100 parts of standard resin is more toxic, has two reactions of curing and catalysis, good adhesion, flexibility, applicable Long term.
Diethylaminopropylamine DEAPA(C2H5)2N(CH2)3NH2 Molecular Weight 130 Active Hydrogen Equivalent 65 Low viscosity transparent liquid Curing with 4-8 parts per 100 parts standard resin: 60-70C for 4 hours. Performance: Applicable period 50g 25°C 4 hours, heat deformation temperature 78-94°C, compressive strength 920-1050kg/cm2, tensile strength 480-640kg/cm2, impact strength 0.2-lb/inch Rockwell hardness 90- 98. Dielectric constant (50 Hz, 23°C) 3.75 Power factor (50 Hz, 23°C) 0.007 Medium temperature curing, good low temperature performance.
Trimethylhexamethylenediamine TMD (H2N) 2 (C6H9) (CH3) 3 is a colorless liquid that cures cold, has a long pot life and is less toxic. 21 parts per 100 parts of standard resin: 1 hour at 80°C + 2 hours at 150°C. Performance: Applicable period 400g 25°C 50 minutes or 50°C 10 minutes, Martin heat resistance 92°C, bending strength 1150kg/cm2, impact strength 20Kg-cm/cm2tgδ0.0009 (23°C, 100C/S) Surface resistance 5.4x1011Ω (300V) Volume resistance 9x1015Ω.cm (300V) Medium temperature curing, low temperature performance.
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