Application range: Generally used for potting of non-precision electronic devices such as LEDs, transformers, regulators, industrial electronics, relays, controllers, power modules, etc.
Disadvantages: weak resistance to hot and cold changes, easy to crack after being affected by cold and heat, resulting in water vapor infiltrating into electronic components from the cracks, poor moisture resistance; after curing, the colloid has high hardness and brittleness, and high mechanical stress Easy to scratch electronic components; epoxy resin cannot be opened due to higher hardness after potting and curing, so the product is a "lifetime" product, and the replacement of components cannot be achieved; the epoxy resin material for transparent is generally poor in weather resistance, It is easy to produce yellowing under light or high temperature.
Advantages: Most epoxy resin encapsulants are hard, and some modified epoxy resins are slightly softer. The biggest advantage of this material is that it has better adhesion to the material and better insulation, and the cured product has good acid and alkali resistance. Epoxy resins generally have a temperature resistance of 100 ° C. The material can be used as a transparent material with good light transmission. The price is relatively cheap.
The difference between polyurethane encapsulant and epoxy encapsulant
1. Epoxy resin
Electronic potting glue is a broad term. Used for bonding, sealing, potting and coating protection of electronic components. Before being cured, the potting glue is liquid and has fluidity. The viscosity of the glue liquid varies according to the material, performance and production process of the product. Its use value can be realized only after it is completely cured. After curing, it can play the role of waterproof and moisture proof, dustproof, insulation, heat conduction, secrecy, anticorrosion, temperature resistance and shockproof. At present, there are many types of electronic potting adhesives on the market, divided by material type. At present, the most commonly used are the three most common types, namely epoxy resin potting adhesives, silicone potting adhesives, and polyurethane potting adhesives. The choice of potting glue will directly affect the precision and timeliness of the operation of electronic products. How to choose the potting glue suitable for enterprise products among many types of potting glue has become a technical difficulty. Next, Hangzhou Boulder New Materials will introduce the advantages and disadvantages of these three types of potting adhesives and the main uses in the current market.
Second, polyurethane
Advantages: Polyurethane encapsulant has excellent low temperature resistance, slightly soft material, good adhesion to general encapsulation materials, and the adhesion is between epoxy resin and silicone. It has good waterproof, moisture-proof and insulation properties.
In summary, the performance of silicone encapsulant is better than epoxy resin encapsulant, so the pursuit of better protective effect, the first choice should be silicone encapsulant. As a professional R & D and production silicone encapsulant manufacturer, our company will also provide our customers with the best product glue solution, protect electronic components from the natural environment, improve the heat dissipation capacity of electronic components, Moisture resistance and seismic performance ensure the stability of electronic components.
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