New composite materials allow faster cooling of electronic devices

According to reports recently organized by the Physicist Organization Network, American scientists have developed a more effective and cheaper way to cool down electronic devices. The new method is particularly suitable for cooling electronic devices such as lasers and power generating devices that generate a lot of heat.

The new technology uses a "heat diffuser" made of copper-graphene composites. The scientists borrowed an indium-graphene interface film to attach the “heat diffuser” to the electronics to cool the electronics. The author of the study, Assistant Professor of Materials Science and Engineering at North Carolina State University, Jig Cascellella, said: "Copper-graphene and indium-graphene have extremely high thermal conductivity, which can make the equipment fast. Effectively cool down."

Castellara discovered that the high thermal conductivity of the copper-graphene film made it cool down by 25% faster than the pure copper used in most current equipment. It is very important that the electronic device emits heat because it becomes unusable when it is overheated.

Scientists have fabricated this copper-graphene composite through an electrochemical deposition process. Castellara pointed out: "Copper-graphene composites are very low cost and easy to manufacture. Copper is expensive, so replacing part of the copper with graphene can reduce costs." (Liu Xia)

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